Silicon Direct Bonding SDB, anodic, silicon fusion, thermocompression and eutectic bonding

Our 1350m² facility includes 750m² of MEMS production, assembly, packaging, test and characterization areas. We offer a complete portfolio of equipment and process steps to fulfill an extensive range of development and manufacturing requirements. Our six-inch wafer MEMS fab excels at a variety of silicon, SOI and glass wafer processing capabilities:

Design, Modelling and Simulation	back to top
Coventor MEMS Designer COMSOL Multiphysics (FEM) Matlab Simulink
Characterization	back to top
Product-specific characterization benches High-precision position and rate table Rotation stage for low-G accelerometer characterization Pressure sensor bench Automatic static and dynamic wafer probers Network analyser Climatic chamber (T°, H°)
Reliability Testing	back to top
Drop tower shock test (20,000G) Centrifuge (26,000G) Climatic chamber (T°, H°) Vacuum packaging ageing bench Bond tester (pull, push, shear and peel tests, tweezer)
Planning, Traceability and Quality Control	back to top
Production planning system WIP tracking system Traceability system from materials supply to final tests FMEA methodologies and tools SPC/QPC Equipment and process Cp/Cpk controls
Lithography	back to top
On-track resists coating and developing Double-side alignment Proximity and contact photolithography Shadow masks and lift-off processes
DRIE Deep Dry Etching	back to top
Deep Reactive Ion Etching with ICP reactors (Bosch Process) High Aspect Ratio (up to 1:30) DRIE Micromachining Deep trench DRIE plasma etching Laser drilling
RIE and Plasma etching	back to top
RIE: Si, PolySi, SiO2 and Si3N4 etching O2 plasma etchers
Wet Chemical Etching	back to top
Automatic Wet benches KOH and TMAH Silicon etching SiO2 and Si3N4 etching HF sacrificial oxide release Metal etching
Thin Film Deposition and Electroplating	back to top
LPCVD: SiO2 and Si3N4 PECVD: SiO2 and Si3N4 low stress Sputtering and evaporation: Al,Cr, Au, Ti, TiN, W, Al, Cu, Ni, Pt... Electroplating: Au, SnPb, FeNi, Ni, Cu... Annealing and thermal treatment Epitaxy and implantation (sub-contrated)
Wafer Bonding	back to top
Anodic bonding Silicon direct fusion bonding SDB Eutectic bonding Thermo-compression bonding Low Temp Polymer sealing
Metrology	back to top
Digital Holographic Microscopes (3D topography, dynamic behaviour...) Scanning electron microscopes (SEM) Surfscan, on wafer particles control Profilometers Optical and IR microscopes Ultra-sonic, X-Ray, etc... through sub-contractors
Wafer Level Testing	back to top
Automatic Electric Wafer Probers Dynamic on wafer probers (pressure, gyro) Impedance meter, 4 points probers Wafer mapping software system
Thinning, Grinding, Polishing, Dicing	back to top
Wafer thinning Grinding and Dry polishing Chemical Mechanical Polishing (CMP) Dicing of silicon and glass wafers
Assembly and Packaging	back to top
Custom and Standard packages assembly Pick and place die bonder Automatic and manual wire bonder Precision welder High vacuum encapsulation with getter activation Flip-Chip mounting
Testing	back to top
Product- and application-specific tests Static and dynamic dies test benches Static and dynamic components test benches Network analyser (Q factor, resonant and cut-off frequency...) Anti-sticking burn-in test Vacuum packaging ageing test Microfluidics component tests Climatic chamber burn-in (T°, H°)