implantable MEMS packaging feedthrough

Packaging is a major cost driver and will continue to represent a significant technological challenge in the commercialization of MEMS. To address this important issue, Tronics develops, optimizes and qualifies specific packaging solutions for our customers. We then manage the supply chain and deliver qualified packaged components from MEMS dies to smart components.

Our proven packaging expertise, based on a decade of research and development, has established our reputation as a leading provider of unique Wafer Level Packaging and High Vacuum Packaging solutions. We have successfully implemented the following custom MEMS packaging solutions for our customers:

High Vacuum Packaging

Extreme sensitivity sensors must be operated under high vacuum to decrease noise and increase their bandwidth. In production since 2002, our packaging technique has been validated through extensive qualification and long-term reliability studies and is one of the few proven and reliable industrial responses to this challenge available worldwide.

• High vacuum < 1 mTorr
• Long-term stability ensured by getter
• Standard or custom LCC housing

Vacuum Wafer Level Packaging

Vacuum encapsulation is a key requirement for high-performance resonating sensors, high-speed actuators, and other innovative functions. At the crossroads of our Wafer Level Packaging and High Vacuum Packaging expertise, we are currently qualifying innovative integrated vacuum WLP, including:

• High vacuum < 10 mTorr
• Long-term stability ensured by integrated getter
• Full batch processing

Wafer Level SMT Chip Size Packaging

When size, mountability, and performance are key for our customers' systems, our patented solderable wafer level chip-size packaging (CSP) technology provides a proven, reliable solution. Essential, proven benefits of this innovative solution are:

• Vertical or horizontal SMT solder mounting of the chip
• Smallest foot print
• Ultra-low parasitic capacitances thanks to via technology

Optical Wafer Level Packaging

Optical MEMS components such as mirror arrays require specific packaging to manipulate optical beams and interact with the system, while being protected from dust, humidity and particles. Our proprietary technology features:

• Low-temperature water-proof sealing
• Anti-reflective optical window
• Access to electrical contacts via wire bonding

Wire-bondable Wafer Level Packaging

Batch processing, ease of handling and protection of the microstructures from dust and particles are essential benefits of Wafer Level Packaging technology for our customers. Our expertise and capabilities also enable:

• Adaptability to different designs
• Hermetic sealing
• Integration in standard package through wire bonding