Wafer bonding and stacking, KOH TMAH Etching

Over the years Tronics Microsystems has demonstrated its rigorous and methodological approach to industrializing and qualifying high value-add commercial MEMS products. This commitment has produced predictable MEMS success for our growing, select customer base in Europe, North America and Japan, while producing continuous profitability for the company.

Production-proven Technologies

We qualify and set-up specific technologies based on proven process modules. We have unrivalled know-how in the following technologies:

• Notch-free, high verticality and high aspect ratio DRIE on thick SOI
• Through-wafer silicon DRIE etching
• Residues-free etching and releasing over cavities
• Sticking-free sacrificial release
• Wafer stacking with wafer bonding
• Time-controlled and etch-stop KOH and TMAH etching
• Wafer level and vacuum packaging
• Specific testing and aging protocols for capacitive and electrostatic structures

With Efficient FMEA and SPC Methodologies

We have developed considerable expertise and methodologies in conducting Failure Modes and Effects Analysis (FMEA) for our customer-specific products. Together with our partners, we continuously track and classify the product-failure modes and their causes along the processes and supply chain.

Once the causes are identified we build the set of relevant manufacturing indicators. Systematic FMEA and Statistical and Quality Process Controls (SPC and QPC) allow us to:

• anticipate product failures and make early corrective actions
• continuously enhance yields
• get return on experience for the next product generations.